Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-08-05
1993-04-06
Tolin, Gerald P.
Metal working
Method of mechanical manufacture
Electrical device making
174 152, 16510433, 257714, 361385, H05K 720
Patent
active
051991659
ABSTRACT:
Method and apparatus for controlling the temperature of one or more electrical component chips positioned on a face of a substrate and for providing component-to-component electrical interconnect traces between the chips. One or a selected set of electrical interconnections, contained within the substrate and connected to a chip, is also connected to a column of high electrical and thermal conductivity material within the substrate that is in direct thermal contact with the working fluid in a heat pipe. The heat pipe is sealed and is contained in the substrate interior and is in electrical and thermal contact with the electronic components on a chip. The heat pipe working fluid receives heat from the electronic components through the thermally conducting column, changes phase through absorption of this heat, and transports the heat to heat dissipation means located elsewhere.
REFERENCES:
patent: 2350348 (1944-06-01), Gaugler
patent: 3361195 (1968-01-01), Meyerhoff
patent: 3564109 (1971-02-01), Ruechardt
patent: 4047198 (1977-09-01), Sekhon
patent: 4327399 (1982-04-01), Sasaki
patent: 4519447 (1985-05-01), Wiech, Jr.
patent: 4631636 (1986-12-01), Andrews
patent: 4727454 (1988-02-01), Neidig
patent: 4859520 (1989-08-01), Dubuisson
patent: 4878152 (1989-10-01), Sauzade
patent: 4967314 (1990-10-01), Higgins, III
patent: 4994215 (1991-02-01), Wiech, Jr.
patent: 5095359 (1992-03-01), Tanaka
"Heat Pipes", third edition, Dunn et al, International Research and Dev. Co Ltd, Newcastle upon Tyne, UK, no date.
Heat Pipes, Dunn and Reay, Pergamon Press, 1982 pp. 272-281.
Chen Kim H.
Crawford Robert K.
Leibovitz Jacques
Miller Daniel J.
Hewlett--Packard Company
Tolin Gerald P.
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