Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-03-29
1996-10-22
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361700, 174 152, 16510433, H05K 720, F28D 1502
Patent
active
055683606
ABSTRACT:
A heat transfer system is provided for dissipating thermal energy within the personal computer. The transfer system is designed to move heat from a heat source, such as a central processing unit (CPU), to a heatsink arranged upon the portable computer keyboard. The heat transfer mechanism includes a heat slug thermally coupled to the CPU heat source and a heat pipe thermally coupled to a backside surface of a computer keyboard. The heat pipe is designed having minimal thermal gradient, and includes an evaporation/condensation cycle associated with its operation. The heat pipe is preferably orthogonally shaped having at least one flat surface arranged near the intersection of the orthogonal members. The flat section is in registry with a heat source. Movement of the flat section relative to the heat source effectuates abutment and thermal contact therebetween. The present thermal energy transfer system is designed for enhanced heat transfer within a portable computer system without undergoing the disadvantages of bulky finned heatsinks and/or fans.
REFERENCES:
patent: 5402311 (1995-03-01), Nakajima
IBM Technical Disclosure Bulletin, CPU Cooling System for Notebook PC, vol. 37 No. 11.
Kizer Jim J.
Penniman Mark B.
Schlesener Carmen M.
Dell USA L.P.
Gandhi Jayprakash N.
Garrana Henry N.
Kahler Mark P.
Picard Leo P.
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