Heat pipe cooling system

Details Heat pipe cooling system Heat pipe cooling system

2005-12-27

2005-12-27

McKinnon, Terrell (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S045000

Reexamination Certificate

active

06978828

ABSTRACT:
Systems and techniques for cooling a component within a housing using a composition of heat pipes. The housing contains a first heat pipe having a condenser section and an evaporator section; a plurality of secondary heat pipes, each having condenser and an evaporator sections, disposed in parallel within the housing with the evaporator sections of the secondary pipes near the condenser section of the first heat pipe; wherein the plurality of secondary heat pipes are adapted to absorb heat rejected from the condenser section of the first heat pipe for distribution from the condenser sections of the secondary heat pipes. A cooling method entails disposing the primary and secondary heat pipes within the housing; adapting the secondary pipes to absorb heat rejected from the primary pipe; and distributing the heat absorbed by the secondary heat pipes toward an end of the housing.

REFERENCES:
patent: 2350348 (1944-06-01), Gaugler
patent: 2671323 (1954-03-01), Richert
patent: 2711084 (1955-06-01), Bergan
patent: 3038074 (1962-06-01), Scherbatskoy
patent: 4133376 (1979-01-01), Eilenberg et al.
patent: 4375157 (1983-03-01), Boesen
patent: 4513352 (1985-04-01), Bennett et al.
patent: 4517459 (1985-05-01), Richter, Jr. et al.
patent: 4880050 (1989-11-01), Nakamura et al.
patent: 4897997 (1990-02-01), Meijer et al.
patent: 5699982 (1997-12-01), Daugherty
patent: 5720342 (1998-02-01), Owens et al.
patent: 5735489 (1998-04-01), Drolen et al.
patent: 5806803 (1998-09-01), Watts
patent: 5823477 (1998-10-01), York
patent: 5931000 (1999-08-01), Turner et al.
patent: 6052285 (2000-04-01), Hileman
patent: 6134892 (2000-10-01), Turner et al.
patent: 6148906 (2000-11-01), Li et al.
patent: 6216804 (2001-04-01), Aumann et al.
patent: 6336408 (2002-01-01), Parrott et al.
patent: 6341498 (2002-01-01), DiFoggio
patent: 6351951 (2002-03-01), Guo et al.
patent: 6378631 (2002-04-01), Aumann et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6474074 (2002-11-01), Ghoshal
patent: 6595269 (2003-07-01), Mitchell
patent: 6639797 (2003-10-01), Saeki et al.
patent: 6659204 (2003-12-01), Aumann et al.
patent: 6717811 (2004-04-01), Lo et al.
patent: 6717813 (2004-04-01), Garner et al.
patent: 6741468 (2004-05-01), Jing et al.
patent: 2003/0000683 (2003-01-01), Mast et al.
patent: 2003/0056936 (2003-03-01), Lindemuth et al.
patent: 2003/0136548 (2003-07-01), Parish et al.
patent: 2003/0161102 (2003-08-01), Lee et al.
patent: 2003/0196787 (2003-10-01), Mahoney
patent: 2003/0230398 (2003-12-01), Lee et al.
patent: 2004/0042169 (2004-03-01), Artman et al.
patent: 2004/0050534 (2004-03-01), Malone et al.
patent: 2004/0052052 (2004-03-01), Rivera
patent: 2004/0056541 (2004-03-01), Steinmeyer
patent: 2004/0057205 (2004-03-01), Chen et al.
patent: 2004/0069461 (2004-04-01), Yuyama et al.
patent: 2004/0070933 (2004-04-01), Sarraf et al.
patent: 2004/0070942 (2004-04-01), Tomioka et al.
patent: 2004/0074633 (2004-04-01), Liu
patent: 2004/0085733 (2004-05-01), Leon et al.
patent: 2004/0089012 (2004-05-01), Chen et al.
patent: 2004/0099407 (2004-05-01), Parish, IV et al.
patent: 58-198690 (1983-11-01), None
patent: 61-225582 (1986-10-01), None

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