Heat pipe cooling arrangement for integrated circuit chips

Details Heat pipe cooling arrangement for integrated circuit chips Heat pipe cooling arrangement for integrated circuit chips

1979-12-27

1982-04-27

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 15HP, H05K 720

Patent

active

043273998

ABSTRACT:
A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Integrated circuit elements, integrated circuits or integrated circuit devices are securely inserted in holes which are formed on the surface or the back of the substrate and which communicate with the cavity so that the wick on their backs is aligned with the wick on the inner surface of the cavity for directly cooling the integrated circuit elements, the integrated circuits or the integrated circuit devices.

REFERENCES:
patent: 2958021 (1960-10-01), Cornelison
patent: 3739232 (1973-06-01), Grossman
patent: 4000776 (1977-01-01), Kroebig
patent: 4037270 (1977-07-01), Ahmann
patent: 4054938 (1977-10-01), Morris, Sr.
patent: 4106188 (1978-08-01), Sekhon

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