Heat pipe cooled electronics enclosure

Details Heat pipe cooled electronics enclosure Heat pipe cooled electronics enclosure

2006-04-18

2006-04-18

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330, C174S015100, C361S690000, C361S703000

Reexamination Certificate

active

07031158

ABSTRACT:
An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.

REFERENCES:
patent: 4449576 (1984-05-01), Baum et al.
patent: 4465899 (1984-08-01), Mauclere et al.
patent: 4679250 (1987-07-01), Davis et al.
patent: 5329425 (1994-07-01), Leyssens et al.
patent: 5343358 (1994-08-01), Hilbrink
patent: 5777846 (1998-07-01), Hayes et al.
patent: 5842514 (1998-12-01), Zapach et al.
patent: 5844777 (1998-12-01), Gates
patent: 5896268 (1999-04-01), Beavers
patent: 5949650 (1999-09-01), Bulante et al.
patent: 6055157 (2000-04-01), Bartilson
patent: 6104611 (2000-08-01), Glover et al.
patent: 6118662 (2000-09-01), Hutchison et al.
patent: 6169247 (2001-01-01), Craft et al.
patent: 6292556 (2001-09-01), Laetsch
patent: 6310772 (2001-10-01), Hutchison et al.
patent: 6404637 (2002-06-01), Hutchison et al.
patent: 6628521 (2003-09-01), Gustine et al.

Affiliated with

Also associated with

Rating

Heat pipe cooled electronics enclosure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pipe cooled electronics enclosure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pipe cooled electronics enclosure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3524606