Heat pipe attached to a printed wiring board

Details Heat pipe attached to a printed wiring board Heat pipe attached to a printed wiring board

1998-06-03

2000-12-12

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361719, H05K 100

Patent

active

06160223&

ABSTRACT:
A multi-layer printed wiring board includes multiple dielectric cores and conductive layers. The conductive layers include a first layer having a first thickness and a first set of line widths, and a second layer having a second thickness and a second set of line widths. The first thickness is greater than the second thickness. A heat pipe is attached to the printed willing board rather than to an integrated circuit with surface mounting, connection by through holes or with tabs.

REFERENCES:
patent: 5975195 (1999-12-01), Lowry et al.

Affiliated with

Also associated with

Rating

Heat pipe attached to a printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pipe attached to a printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pipe attached to a printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-220093