Heat pipe arrangement for enhancing the cooling capacity of a la

Details Heat pipe arrangement for enhancing the cooling capacity of a la Heat pipe arrangement for enhancing the cooling capacity of a la

1997-09-23

1999-08-31

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 152, 16510433, 16371, G06F 120, H05K 720

Patent

active

059461870

ABSTRACT:
An arrangement for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCS) is enhanced by transferring heat through a flexible heat pipe which is arranged in operative relationship with a novel hinge structure incorporating link elements pivotably interconnecting a display panel with a bottom processor housing so as to impart minimal bending stresses to the flexible heat pipe responsive to pivoting of the display panel, and which facilitates transferring the heat into an area at the rear of the display panel.

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patent: 4493316 (1985-01-01), Reed et al.
patent: 5383340 (1995-01-01), Larson et al.
patent: 5621613 (1997-04-01), IIaley et al.
patent: 5646822 (1997-07-01), Bhatia et al.
patent: 5790376 (1998-08-01), Moore
Albert Yu, "The Future of Microprocessors", IEEE Micro, Dec. 1996, pp. 46-53.

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