Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-01-16
2007-01-16
Fiorilla, Chris (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S268000, C156S345420, C438S464000
Reexamination Certificate
active
10404861
ABSTRACT:
A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 μm or less.
REFERENCES:
patent: 5032438 (1991-07-01), Sakumoto et al.
patent: 5114789 (1992-05-01), Reafler
patent: 5441810 (1995-08-01), Aizawa et al.
patent: 5534102 (1996-07-01), Kadono et al.
patent: 5609954 (1997-03-01), Aizawa et al.
patent: 2002/0192463 (2002-12-01), Kiuchi et al.
patent: 0 612 823 (1994-08-01), None
patent: 51-24534 (1976-07-01), None
patent: 56-61467 (1981-05-01), None
patent: 56-61468 (1981-05-01), None
patent: 56-61469 (1981-05-01), None
patent: 63-33487 (1988-02-01), None
patent: 2-305878 (1990-12-01), None
patent: 5-43851 (1993-02-01), None
patent: 60-252681 (1995-12-01), None
patent: 11-302610 (1999-11-01), None
Patent Abstracts of Japan—10168401 (Jun. 23, 1998).
Patent Abstracts of Japan—11166164 (Jun. 22, 1999).
Patent Abstracts of Japan—61078887 (Apr. 22, 1986).
Office Action in corresponding Korean application dated Jan. 13, 2006.
Arimitsu Yukio
Kiuchi Kazuyuki
Murata Akihisa
Oshima Toshiyuki
Chan Sing P.
Fiorilla Chris
Nitto Denko Corporation
Sughrue & Mion, PLLC
LandOfFree
Heat-peelable pressure-sensitive adhesive sheet does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-peelable pressure-sensitive adhesive sheet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-peelable pressure-sensitive adhesive sheet will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3800286