Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2007-05-08
2007-05-08
Vo, Hai (Department: 1771)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C428S3550RA, C428S318400, C428S319300, C428S319700, C428S901000, C156S241000, C156S326000
Reexamination Certificate
active
10123113
ABSTRACT:
A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.
REFERENCES:
patent: 3931073 (1976-01-01), Jackson et al.
patent: 4052483 (1977-10-01), Feeney et al.
patent: 4740416 (1988-04-01), DeCoste et al.
patent: 4968558 (1990-11-01), Fisher et al.
patent: 5441810 (1995-08-01), Aizawa et al.
patent: 5476712 (1995-12-01), Hartman et al.
patent: 5609954 (1997-03-01), Aizawa et al.
patent: 5846622 (1998-12-01), Imaeda
patent: 5897949 (1999-04-01), Luhmann et al.
patent: 6231962 (2001-05-01), Bries et al.
patent: 6432475 (2002-08-01), Yamamoto et al.
patent: 2001/0053814 (2001-12-01), Yamamoto et al.
patent: 0 206 760 (1986-12-01), None
patent: 0 612 823 (1994-08-01), None
patent: 7-183195 (1995-07-01), None
Patent Abstracts of Japan, vol. 1995, No. 10, corresponding to JP-A-7-183195.
Patent Abstracts of Japan, vol. 012, No. 467 (C-550), corresponding to JP-A-63-186791.
Patent Abstracts of Japan, vol. 1998, No. 11, corresponding to JP-A-10-168401.
European Search Report.
Arimitsu Yukio
Kiuchi Kazuyuki
Murata Akihisa
Oshima Toshiyuki
Nitto Denko Corporation
Sughrue & Mion, PLLC
Vo Hai
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