Metallurgical apparatus – Means treating solid metal
Reexamination Certificate
2006-05-31
2009-06-30
Wyszomierski, George (Department: 1793)
Metallurgical apparatus
Means treating solid metal
C266S274000, C029S03300H
Reexamination Certificate
active
07553444
ABSTRACT:
In a heat mold device1for a guide wire9, the metallic mold body2is made from the material, the thermal expansional coefficient of which is the same of a metallic coiled wire91to stabilize a shape-forming configuration94. A plurality of the mold bodies2are arranged in a mold frame6A to make the reverse side22of one mold body2tightly contact with the obverse side21of other mold body2among the neighboring mold bodies2. A jig arm7A sandwiches an array of metallic mold bodies2and the side plate63to serve as a securement member7. Upon manufacturing the guide wire9well-suited to the medical field, the heat mold device1renders it possible to make a high quality guide wire with a high productivity.
REFERENCES:
patent: 3586303 (1971-06-01), Lee
patent: 5409558 (1995-04-01), Takahasi et al.
patent: 6271601 (2001-08-01), Yamamoto et al.
patent: 6465758 (2002-10-01), Ham
patent: 1 419 787 (2004-05-01), None
patent: 7-255856 (1995-10-01), None
patent: 3300155 (2002-04-01), None
patent: 2004-222880 (2004-08-01), None
Asahi Intecc Co., Ltd.
Morgan & Lewis & Bockius, LLP
Wyszomierski George
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