Heat management in circuit card assemblies

Details Heat management in circuit card assemblies Heat management in circuit card assemblies

2005-06-10

2010-02-09

Hyeon, Hae Moon (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S748000

Reexamination Certificate

active

07660125

ABSTRACT:
A circuit card assembly (CCA) comprises a printed circuit board (PCB) having first and second opposing major faces with a first pair of elongated edges extending therebetween. Heat management layers are disposed within the CCA and/or PCB, which extend to said edges, and a thermally conductive bar is engaged in a slot provided in each of the elongated edges. Each conductive bar extends over at least the thickness of the PCB, one face preferably being flush with one of the major faces of the PCB and is thermally connected to the heat management layer(s) by thermal connecting means so as to conduct heat from the or each heat management layer to said bar.

REFERENCES:
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 5172301 (1992-12-01), Schneider
patent: 5617294 (1997-04-01), Watson et al.
patent: 5825625 (1998-10-01), Esterberg et al.

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