Heat isolation and dissipation structures for optical...

Details Heat isolation and dissipation structures for optical... Heat isolation and dissipation structures for optical...

2005-07-26

2005-07-26

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular temperature control

Heat sink

C372S034000, C372S050121, C385S014000

Reexamination Certificate

active

06922422

ABSTRACT:
Photonic integrated circuits (PIC) semiconductor chips are provided with thermal isolation and/or heat dissipation structures between integrated optical components in the PIC chip, particularly integrated active optical components. These structures may also serve as a ground path for electrical circuitry on the PIC chip. An important function is the enhanced thermal isolation from, or dissipation of heat from, between adjacent or neighboring optical components in the PIC so that required spacing between adjacent optical components can be made even less than the thickness of the substrate thereby realizing a more compact optical component array on the monolithic PIC chips.

REFERENCES:
patent: 5156999 (1992-10-01), Lee
patent: 5305344 (1994-04-01), Patel
patent: 5648977 (1997-07-01), Miyazaki
patent: 5898211 (1999-04-01), Marshall et al.
patent: 2002/0167013 (2002-11-01), Iwasaki et al.

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