Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...
Patent
1996-02-22
1998-04-28
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Including components having same physical characteristic in...
428 98, 428126, 428192, 428220, 428325, 428407, 428426, 428633, 428649, 428920, 427409, 52306, 52309, 52408, 52553, B32B 900
Patent
active
057442258
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a novel heat insulating board or, to say more particularly, to a novel heat insulating board based on a novel heat insulation theory utilizing a heat gradient as well as a method for heat insulation by using the same.
BACKGROUND ART
In a closed space such as, for example, buildings and containers, it is usual to use various kinds of inorganic or organic heat insulating materials in order to shield transfer of heat from the inside to the outside or from the outside to the inside.
Inorganic heat insulating materials include, for example, glassy heat insulating materials such as glass fibers and foam glass, mineral-based heat insulating materials such as asbestos, slag wool, perlite and vermiculite, ceramic-based heat insulating materials such as porous silica, porous alumina, alumina, magnesia, zirconia and refractory bricks, carbonaceous heat insulating materials such as graphite and carbon fibers and so on while organic heat insulating materials include foamed plastics such as foamed polyethylenes, foamed polystyrenes and foamed polyurethanes, natural material-based heat insulating materials such as wooden boards, corks and plant fibers and so on.
Besides, air-layer heat insulating materials in which, by utilizing the low heat conductivity of gases such as air, they are sealed in aluminum, paper or plastic are also known.
These heat insulating materials serve to suppress transfer of heat by the use of a material which in itself has a low thermal conductivity or to suppress movement of heat by sealing a substance having low heat conductivity such as gases in pores or interstices.
Incidentally, however, it is known that, generally, the efficiency of heat insulation of a porous heat insulating material can be improved when the pores or interstices are increased so as to decrease the density leading to a decrease in the heat conductivity but an overly decrease of the density results in a decrease in the mechanical strength and in an increase of the heat transfer due to convection of the gas by the temperature elevation so that the approach of increasing the pores or interstices inherently has a limitation.
On the other hand, it is a due idea to enhance the effect of heat insulation by increasing the thickness of the heat insulating material though being accompanied by disadvantages in the practical point such as an increase in the cost due to the increase in the amount of the heat insulating material used, increase of the volume required for heat insulation and so on.
DISCLOSURE OF INVENTION
The present invention has been completed with an object to provide a heat insulating material, being entirely different from conventional heat insulating materials by the use of a material having low heat conductivity or by the use of a porous material with a decreased heat conductivity by sealing a gas such as air, based on a novel principle by which a heat gradient is formed from the surface facing the low temperature side toward the surface facing the high temperature side so as to prevent transfer of heat as well as a heat insulating method by the use thereof.
The inventors have conducted investigations on the mechanism for the heat transfer from a high temperature zone to a low temperature zone through a heat insulating board disposed between the high temperature zone and the low temperature zone to arrive at the discovery given below as a result.
That is, when heat is transferred by radiation or convection to the surface of a heat insulating board facing a high temperature zone, the heat on the surface facing the high temperature zone is transferred to the surface facing the low temperature zone in the mode of conduction. And, by being contacted with a low temperature fluid at the surface facing the low temperature zone, the heat is transferred to the low temperature fluid.
The temperature of the heat insulating board in contact with this low temperature fluid decreases more rapidly or more slowly as the total heat volume of the material constituting the heat in
REFERENCES:
patent: 5030504 (1991-07-01), Botsolas et al.
patent: 5303525 (1994-04-01), Magee
Kujirai Masami
Kujirai Yukio
Kujirai Yumiko
Bahta Abraham
Kabushiki Kaisha Sekuto Kagaku
Ryan Patrick
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