Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
1999-03-10
2001-05-01
Dinkins, Anthony (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C257S719000, C361S718000, C361S719000
Reexamination Certificate
active
06225559
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to the field of housings and, more particularly, to a heat-dissipating housing for electrical or electronic components.
PRIOR ART
The prior art related to housings for semiconductors having thermal contact elements which are connected to the inside of the housing for the purpose of heat dissipation includes German Patent Application DE 36 29 552 A1. In order to attain reliable heat transfer, the semiconductor components are screwed to one of the side portions of a U-section. Instead of the screw joint, spring pressure elements may also be provided as is shown in German Patent DE 92 13 671 U1. It is also known to solder correspondingly constructed power semiconductors to heat sinks.
In general, the known connecting techniques for establishing a thermal contact in a housing require, irrespective of whether they function in a mechanical-force locking manner or in a manner connected by a material joint, result in an increased outlay in terms of components and assembly cost with the consequent risk of additional fault sources being introduced in the design.
OBJECTS AND SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a heat-dissipating housing for electrical or electronic components which equipped with at least one printed circuit board on which electrical or electronic components are mounted and having a portion which can be deformed or moved in a way such that thermal contact between the electrical or electronic components can be established without the need for assembly of any additional parts.
Another object of the present invention is to provide a heat-dissipating housing which can be manufactured economically as a unitary structure.
The foregoing and other objects and advantages of the present invention will appear more clearly hereinafter. In accordance with the present invention there is provided a heat-dissipating housing for electrical or electronic components which consists of a light-metal section preferably on three peripheral sides which has at least one side which either is already integrally formed in a displaced fashion or rotated in the course of extrusion or which can be displaced by being bent in the course of assembly. After the introduction of the populated printed circuit board with the electronic or electrical components which are mounted thereon and which have respective thermal contact elements, the displaced side is rotated into a final or installed position which is generally perpendicular to the base of the housing.
Thermal contact between the thermal contact elements of the relevant components on the printed circuit board and a contact area inside the housing is established, at the same time, by the rotated side of the housing pressing the thermal contact elements of the components against a heat-dissipating contact area on the housing either directly or indirectly via an intermediate element. For this purpose the geometrical dimensions are chosen such that the contact pressure obtained is one which minimizes the thermal contact resistance between the thermal contact elements of the components to be cooled and the contact area inside the housing. At the same time, this thermal contact can additionally be utilized to produce potential equalization between the printed circuit board and the housing with corresponding potential equalization protective contacts.
REFERENCES:
patent: 5309979 (1994-05-01), Brauer
patent: 5321582 (1994-06-01), Casperson
patent: 5959839 (1999-09-01), Gates
Diehl Martin
Hubner Karsten
Baxley Charles E.
Dinkins Anthony
Lenze GmbH & Co.
Ngo Hung V
LandOfFree
Heat-insulated housing to accommodate electrical or... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-insulated housing to accommodate electrical or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-insulated housing to accommodate electrical or... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2530952