Heat generating element cooling device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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310 58, 310 67R, H05K 720

Patent

active

061669040

ABSTRACT:
A heat generating cooling device including a heat sink with a plurality of fins and a cooling fan unit mounted on and above the fins and having a motor. At least one auxiliary blade is provided on the bottom surface of the motor and extends in toward the thickness direction of the heat sink. The fins can be formed short to provide blade clearance.

REFERENCES:
patent: 3566958 (1971-03-01), Zelina
patent: 4469970 (1984-09-01), Neumann
patent: 4568846 (1986-02-01), Kapadia
patent: 4835658 (1989-05-01), Bonnefoy
patent: 4940085 (1990-07-01), Nelson et al.
patent: 4949219 (1990-08-01), Moriizumi et al.
patent: 4996585 (1991-02-01), Gruber et al.
patent: 5019880 (1991-05-01), Huggins, III
patent: 5077601 (1991-12-01), Hatada et al.
patent: 5309983 (1994-05-01), Bailey
patent: 5365400 (1994-11-01), Ashiwake et al.
patent: 5384687 (1995-01-01), Sano
patent: 5484262 (1996-01-01), Thomas et al.
"An Enhancement of Heat Sink Using Air Collector and Duct", Research Disclosure, No. 330, Oct., 1991, Emsworth, GB, p. 813.
"Air-Cooling Modular Package", IBM Technical Disclosure Bulletin, vol. 21, No. 11, Apr., 1979, New York, pp. 4485-4486, U.P. Hwang et al.
Kerjilian, Q. K. et al; "Heat-Pipe Cooled Stacked Electronis Wafer Package", IBM Technical Disclosure Bulletin, vol. 18, No. 12, May, 1976, p. 3982.
Patent Abstracts of Japan, vol. 8, No. 181 (E-261) [1618], Aug. 21, 1984 & JP-A-59 072968 (Fanuc), Apr. 25, 1984.
Patent Abstracts of Japan, vol. 8, No. 161 (E-257) [1598], Jul. 26, 1984 & Japan-A-59 059057 (Fanuc), Apr. 4, 1984.

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