Heat fusible polyimide compound films and process for producing

Details Heat fusible polyimide compound films and process for producing Heat fusible polyimide compound films and process for producing

1981-02-25

1982-08-31

Cannon, James C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

4273855, 4272082, 428383, 4284735, B05D 510, B05D 512, B32B 2708, B32B 2728, C09J 702

Patent

active

043472869

ABSTRACT:
A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR1## with an aromatic diamine into imide, provided on at least one surface of the polyimide film, and a process for producing the film.

REFERENCES:
patent: 3505168 (1970-04-01), Dunphy
patent: 3684646 (1972-08-01), Kreuz et al.
patent: 3770573 (1973-11-01), Dunphy et al.
patent: 3944706 (1976-03-01), Czajka
patent: 4012556 (1977-03-01), Keske et al.
patent: 4070524 (1978-01-01), Keske

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