Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-05-31
1999-10-26
Feild, Lynn D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 165 802, G06F 120, H05K 720
Patent
active
059739207
ABSTRACT:
A heat frame (10) incorporates a mounting frame for mounting multiple circuit boards (38), a heat sink (24), a connector bracket (34), and hinge mounts (12) into one integral component. Heat removed by the heat sink (24) is transferred over the entire heat frame (10) with the aid of a heat pipe (44). Fins 17 dissipate heat through the housing of computer (50) under the display assembly (74). The integral nature of the heat frame (10) reduces assembly and testing costs, as well as providing superior heat transfer and EMI/RFI grounding.
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Altic James E.
Karl Rex A.
Vinson Samuel L.
Donaldson Richard L.
Feild Lynn D.
Neerings Ronald O.
Texas Instruments Incorporated
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