Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-08-02
2011-08-02
Smith, Matthew (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S784000, C257S787000, C257S792000, C257S793000, C257SE21502, C438S612000, C438S615000, C438S617000, C438S106000, C438S124000
Reexamination Certificate
active
07989949
ABSTRACT:
A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103aand104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.
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Gupta Vikas
Gurrum Siva P
Howard Gregory E
Brady III Wade J.
Parker John M
Smith Matthew
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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