Heat exchanger for integrated circuit packages

Details Heat exchanger for integrated circuit packages Heat exchanger for integrated circuit packages

1982-05-06

1983-12-20

Cline, William R.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

174DIG12, 361386, 361388, 357 81, 165185, F28F 700

Patent

active

044211619

ABSTRACT:
The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.

REFERENCES:
patent: 3325582 (1967-06-01), Ehrmann et al.
patent: 3694699 (1972-09-01), Snyder et al.
IBM Technical Disclosure Bulletin, (vol. 20, No. 12), May 1978, (pp. 5142 & 5143).

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