Heat exchanger for high power electrical component

Heat exchange – Structural installation

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Details

165 803, 165 804, 165 805, 165185, 165908, 361699, 361703, 361707, F28F 700

Patent

active

056602278

ABSTRACT:
A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit.

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