Heat exchange – Structural installation
Patent
1994-01-31
1997-08-26
Ford, John K.
Heat exchange
Structural installation
165 803, 165 804, 165 805, 165185, 165908, 361699, 361703, 361707, F28F 700
Patent
active
056602278
ABSTRACT:
A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit.
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Crowe Lawrence E.
Ford John K.
Sundstrand Corporation
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