Heat exchanger assembly and method for making the same

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165165, 361704, 361707, H05K 720, H01L 2326

Patent

active

057772592

ABSTRACT:
A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer, a second oxygen-rich copper base layer joined to the second beryllium oxide layer, and a heat exchanger structure direct bonded to the second base layer. The structure has a plurality of oxygen-rich copper fins stacked upon one another, each fin having a channel at a selected location therein. The material to material interfaces between adjacent stacked fins are joined to one another by direct bonding so as to form a solidified block structure. Each of the channels form a cooling chamber for receiving a fluid flow.

REFERENCES:
patent: 2269523 (1942-01-01), Deutsch
patent: 2994203 (1961-08-01), Lackey et al.
patent: 3091028 (1963-05-01), Westbrook et al.
patent: 3110571 (1963-11-01), Alexander
patent: 3226822 (1966-01-01), Budde et al.
patent: 3668755 (1972-06-01), Larsen
patent: 3668758 (1972-06-01), Krock et al.
patent: 3736649 (1973-06-01), Bristow
patent: 3744120 (1973-07-01), Burgess et al.
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3829598 (1974-08-01), Darnell
patent: 3854892 (1974-12-01), Burgess et al.
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3993411 (1976-11-01), Babock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 3996603 (1976-12-01), Smith
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4242598 (1980-12-01), Johnson et al.
patent: 4408218 (1983-10-01), Grabbe
patent: 4409278 (1983-10-01), Jochym
patent: 4413766 (1983-11-01), Webster
patent: 4420509 (1983-12-01), Barrell et al.
patent: 4483810 (1984-11-01), Bunk et al.
patent: 4500029 (1985-02-01), Yerman
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4538170 (1985-08-01), Yerman
patent: 4624404 (1986-11-01), Ohmae et al.
patent: 4639760 (1987-01-01), Granberg et al.
patent: 4640723 (1987-02-01), Sugai et al.
patent: 4646129 (1987-02-01), Yerman
patent: 4649416 (1987-03-01), Borkowski
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 4809135 (1989-02-01), Yerman
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 4811893 (1989-03-01), Kanahara et al.
patent: 4860939 (1989-08-01), Guinet et al.
patent: 4869758 (1989-09-01), Watanabe et al.
patent: 4987677 (1991-01-01), Tanaka et al.
patent: 4990720 (1991-02-01), Kaufman
patent: 4996116 (1991-02-01), Webster
patent: 5014113 (1991-05-01), Casto
patent: 5020586 (1991-06-01), Mansingh
patent: 5036584 (1991-08-01), Beauregard et al.
patent: 5040292 (1991-08-01), Siuzdak
patent: 5075759 (1991-12-01), Moline
patent: 5082163 (1992-01-01), Kanahara et al.
patent: 5097385 (1992-03-01), Chu et al.
patent: 5125451 (1992-06-01), Matthews
patent: 5126511 (1992-06-01), Beauregard et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5176309 (1993-01-01), Horiguchi et al.
patent: 5269372 (1993-12-01), Chu et al.
patent: 5303555 (1994-04-01), Chrysler et al.
patent: 5304846 (1994-04-01), Azar et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5329159 (1994-07-01), Lin
patent: 5370178 (1994-12-01), Agonafer et al.
patent: 5371405 (1994-12-01), Kagawa
patent: 5394299 (1995-02-01), Chu et al.
patent: 5525753 (1996-06-01), Mennucci et al.
patent: 5583317 (1996-12-01), Mennucci et al.
patent: 5602720 (1997-02-01), Natsuhara et al.
Markstein, Howard W., Sep., 1995, "Optimizing Heat Sink Performance".
Levine, Bernard, Electronic News, Jan. 1, 1996, "Alcoa Eyes Packaging Fate As Intel Embraces Plastic".
Kim, James, USA Today, Feb. 17, 1995 , "Intel Unveils P6 Successor To Pentium".
Tummala, Rao R. and Rymaszewski, Eugene J., Van Nostrand , New York 1989, "Microelectronics Packaging Handbook", Sections 1.3.5. and 8.2.
Vemaline Brochure, copyright 1994, "Cool Your 486 or Pentinum.TM. Processor".
Karavolis, Michael, Dec. 1993, "Production of Precision Clad `Self Brazing` Materials to Achieve High Yields and Strong Joints".
Mahney, H.V. and Vader, D.T., "Predicted and Measured Performance of an Advanced Laminated Heat Sink for Multi-Chip Modules", Nov. 28 -Dec. 3, 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat exchanger assembly and method for making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat exchanger assembly and method for making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat exchanger assembly and method for making the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1208356

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.