Heat exchange – Side-by-side tubular structures or tube sections – With manifold type header or header plate
Reexamination Certificate
2006-12-04
2008-11-11
Duong, Tho V (Department: 3744)
Heat exchange
Side-by-side tubular structures or tube sections
With manifold type header or header plate
C165S176000
Reexamination Certificate
active
07448440
ABSTRACT:
An upper header tank of an evaporator is formed by three plates. The outside plate has an inflow-side refrigerant-passage outwardly bulging portion whose one end portion communicates with a refrigerant inlet. The inside plate has tube insertion holes. The intermediate plate has communication holes for establishing communication between the tube insertion holes of the inside plate and the outwardly bulging portion of the outside plate. The communication holes of the intermediate plate are connected by communication portions so as to form a resin passage communicating with the outwardly bulging portion. Of all the communication portions of the refrigerant passage, a plurality of upstream communication portions are smaller in width than the remaining communication portions. The relation 0.25≦A/B≦0.35 is satisfied, where A represents the number of the narrow communication portions, and B represents the total number of the communication holes which form the refrigerant passage.
REFERENCES:
patent: 5242016 (1993-09-01), Voss et al.
patent: 5934367 (1999-08-01), Shimmura et al.
patent: 6595273 (2003-07-01), Shimoya
patent: 6827139 (2004-12-01), Kawakubo et al.
patent: 2005/0217838 (2005-10-01), Katoh et al.
patent: 2006/0137870 (2006-06-01), Ohhashi et al.
patent: 2007/0044949 (2007-03-01), Ohashi
patent: 2007/0051504 (2007-03-01), Ohashi
patent: 2007/0131391 (2007-06-01), Ichiyanagi
patent: 2005-326135 (2005-11-01), None
U.S. Appl. No. 10/588,774, filed Aug. 8, 2006, Ichiyanagi, et al.
U.S. Appl. No. 10/588,209, filed Aug. 2, 2006, Ichiyanagi.
U.S. Appl. No. 11/578,552, filed Oct. 16, 2006, Ichiyanagi.
U.S. Appl. No. 11/564,038, filed Nov. 28, 2006, Ichiyanagi, et al.
U.S. Appl. No. 11/566,311, filed Dec. 4, 2006, Ichiyanagi, et al.
Ichiyanagi Shigeharu
Take Koichiro
Duong Tho V
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Showa Denko K.K.
LandOfFree
Heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat exchanger will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4028884