Heat exchange – Flow passages for two confined fluids – Interdigitated plural first and plural second fluid passages
Reexamination Certificate
2007-10-09
2007-10-09
Ciric, Ljiljana (Department: 3744)
Heat exchange
Flow passages for two confined fluids
Interdigitated plural first and plural second fluid passages
C165S166000, C165S080500
Reexamination Certificate
active
10266300
ABSTRACT:
A heat exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (142) located alternatingly across the width of the core extend the length of the core. Interconnecting channels (144) each fluidly communicate with a corresponding outlet manifold and the two inlet manifolds located immediately adjacent that outlet manifold. Heat exchanger fin (154) in thermal communication with the heat transfer surface (128) generally defines the surface of the interconnecting channels. A pathway directs the working fluid first towards and then away from heat transfer surface (128) in a direction substantially normal to the heat transfer surface. Heat is transferred to or from the working fluid from heat transfer fin (154) as the fluid flows toward and away from the heat transfer surface.
REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4880055 (1989-11-01), Niggemann et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5016707 (1991-05-01), Nguyen
patent: 5029638 (1991-07-01), Valenzuela
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5145001 (1992-09-01), Valenzuela
patent: 5269372 (1993-12-01), Chu et al.
patent: 5309319 (1994-05-01), Messina
patent: 5429183 (1995-07-01), Hisamori et al.
patent: 5727618 (1998-03-01), Mundinger et al.
patent: 5835345 (1998-11-01), Staskus et al.
patent: 5836383 (1998-11-01), Zwittig
patent: 5843385 (1998-12-01), Dugan
patent: 6005772 (1999-12-01), Terao et al.
patent: 6167952 (2001-01-01), Downing
patent: 6695044 (2004-02-01), Symonds
patent: 6959492 (2005-11-01), Matsumoto et al.
patent: 6994829 (2006-02-01), Whyatt et al.
patent: 7111672 (2006-09-01), Symonds
L.S. Stephens, K.W. Kelly, D. Kountouris & J. McLean, “A Pin Fin Microheat Sink for Cooling Macroscale Conformal Surfaces Under the Influence of Thrust and Frictional Forces”, Journal of Microelectromechanical Systems, vol. 10, No. 2, Jun. 2001, pp. 222-231.
Y. Murakami & B.B. Mikic, “Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip Cooling”, IEEE Transactions on Components and Packing Technologies, vol. 24, No. 1, Mar. 2001, pp. 2-9.
L. Jiang, M. Wong & Y. Zohar, “Forced Convection Boiling in a Microchannel Heat Sink”, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 80-87.
J. Darabi, M.M. Ohadi & D. DeVoe, “An Electrohydrodynamic Polarization Micropump for Electronic Cooling”, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 98-106.
C. Perret, J. Boussey, C. Schaeffer & M. Coyaud, “Analytic Modeling, Optimizing, and Realization of Cooling Devices in Silicon Technology”, IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 4, Dec. 2000, pp. 665-672.
D. Copeland, “Manifold Microchannel Heat Sinks: Analysis and Optimization”, ASME/JSME Thermal Engineering Conference: vol. 4, 1995, pp. 169-174.
D. Copeland, H. Takahira, W. Nakayama & B. Pak, “Manifold Microchannel Heat Sinks: Theory and Experiment”, Advances in Electronic Packing, EEP-vol. 10-2, 1995, pp. 829-835.
A. Weisberg, H.H. Bau & J.N. Zemel, “Analysis of microchannels for integrated cooling”, Int. J. Heat Mass Transfer, 1992, vol. 35, No. 10, pp. 2465-2474.
D.B. Tuckerman & R.F.W. Pease, “High-Performance Heat Sinking for VLSI”, IEEE Electron Device Letters, May 1981, vol. EDL-2, No. 5, pp. 126-129.
Jasinski Thomas J.
Valenzuela Javier A.
BainwoodHuang
Ciric Ljiljana
Mikros Manufacturing, Inc.
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