Heat exchange module for electronic components

Details Heat exchange module for electronic components Heat exchange module for electronic components

2006-01-25

2010-02-23

Flanigan, Allen J (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104330, C361S697000

Reexamination Certificate

active

07665509

ABSTRACT:
A heat exchange module (1) is disclosed, which includes an evaporator (20), a condenser (50) and a heat sink (22). The evaporator defines therein a chamber for containing a wick structure (20c) saturated with a working fluid. The wick structure occupies a portion of the chamber. The condenser is disposed adjacent to the evaporator, wherein the working fluid turns into vapor in the evaporator after absorbing heat of a heat-generating component and the vapor turns into condensate at the condenser after releasing the heat. The heat sink is attached to an outer surface of the evaporator and located in alignment with the wick structure contained in the evaporator.

REFERENCES:
patent: 5647430 (1997-07-01), Tajima
patent: 6381135 (2002-04-01), Prasher
patent: 6779595 (2004-08-01), Chiang
patent: 6808013 (2004-10-01), Lai et al.
patent: 6967845 (2005-11-01), Chiang et al.
patent: 7431071 (2008-10-01), Wenger
patent: 2002/0062648 (2002-05-01), Ghoshal
patent: 2003/0011990 (2003-01-01), Lai et al.
patent: 2004/0070941 (2004-04-01), Ghosh et al.
patent: 2005/0217829 (2005-10-01), Belits et al.
patent: 2006/0102324 (2006-05-01), Mok et al.
patent: 2006/0175043 (2006-08-01), Peng
patent: 2006/0289149 (2006-12-01), He
patent: 2457554 (2001-10-01), None
patent: 2569345 (2003-08-01), None

Affiliated with

Also associated with

Rating

Heat exchange module for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat exchange module for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat exchange module for electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4154030