Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-28
2010-11-02
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679520, C361S690000, C361S692000, C361S704000, C361S707000, C165S104330, C165S185000, C174S015200, C174S016100
Reexamination Certificate
active
07826214
ABSTRACT:
A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.
REFERENCES:
patent: 2287328 (1942-06-01), Rose
patent: 3783347 (1974-01-01), Vladik
patent: 3961666 (1976-06-01), Suzuki et al.
patent: 4359086 (1982-11-01), Sanborn et al.
patent: 4505326 (1985-03-01), Hazen
patent: 4525769 (1985-06-01), Lehmann
patent: 4535386 (1985-08-01), Frey et al.
patent: 4733335 (1988-03-01), Serizawa et al.
patent: 4734835 (1988-03-01), Vines et al.
patent: 4746479 (1988-05-01), Hanaki et al.
patent: 4749975 (1988-06-01), Tokita et al.
patent: 4771365 (1988-09-01), Cichocki et al.
patent: 4953058 (1990-08-01), Harris
patent: 4980848 (1990-12-01), Griffin et al.
patent: 5049981 (1991-09-01), Dahringer
patent: 5063476 (1991-11-01), Hamadah et al.
patent: 5089935 (1992-02-01), Ito
patent: 5200241 (1993-04-01), Nied et al.
patent: 5213153 (1993-05-01), Itoh
patent: 5218516 (1993-06-01), Collins et al.
patent: 5276584 (1994-01-01), Collins et al.
patent: 5634351 (1997-06-01), Larson et al.
patent: 5671120 (1997-09-01), Kikinisi
patent: 5892278 (1999-04-01), Horita et al.
patent: 5894407 (1999-04-01), Aakalu et al.
patent: 5977694 (1999-11-01), McGuire
patent: 6027535 (2000-02-01), Eberle et al.
patent: 6082444 (2000-07-01), Harada et al.
patent: 6186890 (2001-02-01), French et al.
patent: 6226182 (2001-05-01), Maehara
patent: 6289888 (2001-09-01), Welles
patent: 6355332 (2002-03-01), Kobayashi
patent: 6358595 (2002-03-01), Kobayashi
patent: 6427466 (2002-08-01), Livni
patent: 6459577 (2002-10-01), Holmes et al.
patent: 6478082 (2002-11-01), Li
patent: 6493227 (2002-12-01), Nielsen et al.
patent: 6536514 (2003-03-01), Sugiyama et al.
patent: 6568465 (2003-05-01), Meissner et al.
patent: 6573536 (2003-06-01), Dry
patent: 6650048 (2003-11-01), Wu
patent: 6815724 (2004-11-01), Dry
patent: 6831303 (2004-12-01), Dry
patent: 7144135 (2006-12-01), Martin et al.
patent: 7234844 (2007-06-01), Bolta et al.
patent: 7242028 (2007-07-01), Dry
patent: 7244044 (2007-07-01), Liao
patent: 7288796 (2007-10-01), Dry
patent: 7290913 (2007-11-01), Watanabe et al.
patent: 7300187 (2007-11-01), Huang
patent: 7329033 (2008-02-01), Glovatsky et al.
patent: 7378163 (2008-05-01), Loh et al.
patent: 7427152 (2008-09-01), Erion et al.
patent: 7440280 (2008-10-01), Shuy
patent: 7461951 (2008-12-01), Chou et al.
patent: 7480140 (2009-01-01), Hara et al.
patent: 7595120 (2009-09-01), Loh et al.
patent: 7633751 (2009-12-01), Shinotou et al.
patent: 2002/0122299 (2002-09-01), Kelly et al.
patent: 2003/0128511 (2003-07-01), Nagashima et al.
patent: 2004/0108104 (2004-06-01), Luo
patent: 2004/0114330 (2004-06-01), Yazawa
patent: 2004/0156180 (2004-08-01), Westerinen et al.
patent: 2004/0196628 (2004-10-01), Hisano et al.
patent: 2005/0006065 (2005-01-01), Katsumata et al.
patent: 2005/0098300 (2005-05-01), Kawabata et al.
patent: 2005/0126766 (2005-06-01), Lee et al.
patent: 2005/0219814 (2005-10-01), Yazawa
patent: 2005/0233112 (2005-10-01), Loh et al.
patent: 2006/0238980 (2006-10-01), Bhattacharyya et al.
patent: 2007/0081340 (2007-04-01), Chung et al.
patent: 2007/0091632 (2007-04-01), Glovatsky et al.
patent: 2007/0230183 (2007-10-01), Shuy
patent: 2007/0230184 (2007-10-01), Shuy
patent: 2007/0230185 (2007-10-01), Shuy
patent: 2008/0180955 (2008-07-01), Shuy
patent: 2008/0180969 (2008-07-01), Shuy
patent: 2008/0258598 (2008-10-01), Shuy
patent: 2008/0283403 (2008-11-01), Shuy
patent: 2008/0285298 (2008-11-01), Shuy
patent: 2008/0286544 (2008-11-01), Shuy
patent: 2009/0015125 (2009-01-01), Shuy
patent: 2009/0084530 (2009-04-01), Shuy
patent: 1060924 (1992-05-01), None
patent: 1393929 (2003-01-01), None
patent: 2862179 (2005-05-01), None
patent: 55061049 (1980-05-01), None
patent: 55061049 (1980-05-01), None
patent: 51178487 (1986-08-01), None
patent: 61178487 (1986-08-01), None
patent: 63144697 (1988-06-01), None
patent: 6315265 (1994-11-01), None
patent: 2002195788 (2002-07-01), None
patent: 2004053167 (2004-02-01), None
patent: 2004063794 (2004-02-01), None
Bellettre, J. et al., “A new approach for the study of turbulent boundary layers with blowing,” International Journal of Heat and Mass Transfer, 42:2905-2920 (1999).
Bellettre, J. et al., “Studies of the Transpiration Cooling Through a Sintered Stainless Steel Plate,” Experimental Heat Transfer, 18:33-44, 2005.
Kim, Y. et al. “Transient mixed radiative convection flow of a micropolar fluid past a moving, semi-infinite vertical porous plate,” International Journal of Heat and Mass Transfer 46:1751-1758, 2003.
Kuznetsov, A.V. et al., “Effects of Thermal Dispersion and Turbulence in Forced Convection in a Composite Parallel-Plate Channel: Investigation of Constant Wall Heat Flux and Constant Wall Temperature Cases,” Numerical Heat Transfer, Part a, 42:365-383, 2002.
Wagner, C. et al., “DNS of turbulent flow along passively permeable walls,” International Journal of Heat and Fluid Flow 21:489-498, 2000.
PCT International Search Report (PCT/CN2007/000965) mailed Jul. 5, 2007 (2 pages).
Auvinen Stuart T.
Gandhi Jayprakash N
gPatent LLC
Hong Kong Applied Science and Technology Research Institute Co.
Thomas Bradley H
LandOfFree
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