Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-06
2007-03-06
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C174S015100, C165S080400, C165S104330, C257S714000
Reexamination Certificate
active
10882433
ABSTRACT:
In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.
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Kwok Tarzen
Teneketges Nicholas J.
Aagaard, Esq. Eric J.
Balzan, Esq. Christopher R.
Chervinsky Boris
Teradyne, Inc.
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