Heat-emitting element cooling apparatus

Details Heat-emitting element cooling apparatus Heat-emitting element cooling apparatus

2007-01-30

2007-01-30

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000

Reexamination Certificate

active

11097656

ABSTRACT:
A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.

REFERENCES:
patent: 5724228 (1998-03-01), Lee
patent: 5740014 (1998-04-01), Lin
patent: 5794685 (1998-08-01), Dean
patent: 5943209 (1999-08-01), Liu
patent: 5992511 (1999-11-01), Kodaira et al.
patent: 6023413 (2000-02-01), Umezawa
patent: 6137680 (2000-10-01), Kodaira et al.
patent: 6301110 (2001-10-01), Kodaira
patent: 0 856 888 (1998-08-01), None

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