Heat exchange – With retainer for removable article – Electrical component
Patent
1996-05-10
1998-11-03
Leo, Leonard R.
Heat exchange
With retainer for removable article
Electrical component
165185, 174 163, 257718, 361687, 361704, 361715, 361720, F28F 700, H05K 720
Patent
active
058295151
ABSTRACT:
A technique for dissipating heat generated by a chip in a small, inexpensive, quiet, and reliable manner without drawing power from a power source. In a preferred embodiment, the chip resides in a computer housing and a heat dissipator for the chip is made up of a convection component and a conduction component. The convection component is similar to a conventional heat sink. It includes fins that channel a flow of air therethrough releasing heat into the air. The conduction component is a thermal conductor which attaches to a heat spreader. In the preferred embodiment, the heat spreader is part of the computer housing.
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patent: 5201866 (1993-04-01), Mok
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patent: 5353863 (1994-10-01), Yu
patent: 5411077 (1995-05-01), Tousignant
patent: 5422787 (1995-06-01), Gourdine
patent: 5430609 (1995-07-01), Kikinis
Author unknown, "Flexible Shell Conduction/Convection Cooling Device", Research Disclosure, May 1986, No.265.
Author Unknown, "Spring-Loaded Heat Sinks For VLSI Packages,"Research Disclosure, Oct. 1990, No. 318.
Jeffries John
Wang Ray
Dell U.S.A. L.P.
Leo Leonard R.
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