Heat dissipator including coolant passage and method of fabricat

Details Heat dissipator including coolant passage and method of fabricat Heat dissipator including coolant passage and method of fabricat

1998-06-19

2000-10-10

Leo, Leonard

Heat exchange

Conduit within, or conforming to, panel or wall structure

165 804, 165170, 165133, 257714, 361699, F28F 312, H05K 720

Patent

active

061291455

ABSTRACT:
A heat dissipator includes a heat-conductive substrate, a lid and a heat-conductive cover layer, and a coolant groove for passing a coolant therethrough is formed on a major surface of the substrate. The lid is positioned on the coolant groove to seal the same, and the cover layer covers the major surface of substrate and the lid. The lid may be received in a lid groove to be flush with the major surface of the substrate. The substrate, lid and cover layer are all made of diamond, and are joined together with substantially no other material therebetween. Thus, a high heat conductivity is achieved. The heat dissipator can be a heat dissipating substrate for an electronic component, or an optical transmission window.

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Article entitled "Cold Plate With Nested Cover for D Circuit Module", by R. C. Chu et al., IBM Technical Disclosure Bulletin, vol. 24, No. 11B, Apr. 1982, pp. 6137-6138, New York, US.
Article entitled: "Fabrication of Microchannels in Synthetic Polycrystalline Diamond Thin Films for Heat Sinking Applications", by R. Ramesham et al.; J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1706-1709.

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