Heat dissipator for semiconductor devices

Details Heat dissipator for semiconductor devices Heat dissipator for semiconductor devices

1983-06-16

1985-04-09

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 79, 165 80A, H01L 2302, H01L 2342

Patent

active

045098395

ABSTRACT:
A heat dissipator including a thermally conductive material having a face adapted to contact a semiconductor to be cooled, and a clip for engaging the body and resiliently clamping the semiconductor device against the contact face. The clip has at least one attachment element which, like the leads of the semiconductor device, projects beyond one edge of the dissipator body, the attachment elements being used to join the body and hence the semiconductor device to a support, such as a printed circuit board. The clip may be formed of a solderable material which is different from the material of which the body is formed. The clip may be a single length of bent spring wire, or piece of bent sheet metal.

REFERENCES:
patent: 3548927 (1970-12-01), Spurling
patent: 3572428 (1971-03-01), Monaco
patent: 3694703 (1972-09-01), Wilens et al.
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4215361 (1980-07-01), McCarthy
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4421161 (1983-12-01), Romania et al.

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