Heat dissipator for electronic components

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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Details

165185, 174252, 361707, 361712, 361713, H05K 720

Patent

active

055503268

ABSTRACT:
A low profile heat dissipator for low power IC packages which is formed of a metal, thermally conductive layer, zero, one or two electrically insulative layers positioned on one or both major surfaces of the metal layer, and an adhesive pad which bonds the dissipator to the surface of the electronic component. The dissipator may have a series of score lines formed in its surfaces which allows portions of the dissipator to be bent or removed so as to conform to the available space.

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An Effective Alternative for Marginal Thermal Improvements of Semiconductor Devices; Bernie Siegal, Mark Berg; Tenth IEEE Semi-Therm Synposium .COPYRGT.1994.

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