Heat dissipator for a dual in line integrated circuit package

Details Heat dissipator for a dual in line integrated circuit package Heat dissipator for a dual in line integrated circuit package

1981-01-29

1983-10-04

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

165 80B, 174 16HS, 357 68, H01L 2302, H01L 2348, H01L 2944

Patent

active

044082207

ABSTRACT:
A heat dissipator for use with a dual in line integrated circuit package. The subject dissipator is unitary in construction and formed of a resilient material to facilitate rapid mounting and subsequent removal from an IC package. The dissipator includes a pair of opposed top and bottom contact plates interconnected by an intermediate segment. A radiator plate is provided extending upwardly from the remaining free end of the top contact plate. The dissipator may be slidably mounted on an IC package, with the bottom contact plate being in contact with the bottom wall of the package and with the top contact plate being in coplanar and contiguous relationship with the top wall of the package. By this arrangement, heat generated by the IC package during use is conducted by the top and bottom contact plates to the radiator plate for dissipating the heat and reducing the operating temperature of the package.

REFERENCES:
patent: 3217793 (1965-11-01), Coe
patent: 3249680 (1966-05-01), Sheets et al.
patent: 3378736 (1968-04-01), Vale et al.
patent: 3465212 (1969-09-01), Grimes et al.
patent: 3548927 (1970-12-01), Spurling
patent: 3572428 (1971-03-01), Monaco
patent: 4203488 (1980-05-01), Johnson et al.
patent: 4215361 (1980-07-01), McCarthy
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4261005 (1981-04-01), McCarthy

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