Heat dissipator

Details Heat dissipator Heat dissipator

1993-06-28

1994-05-17

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

165185, 174 163, 257722, 361690, 361703, F28F 700

Patent

active

053119282

ABSTRACT:
The high performance, high reliability compact heat dissipator is useful for cooling electronic components (3, 12, 25). It can be used on transfer surfaces (2, 13, 26) with various orientation for natural convection, or with a combination of natural convection and forced flow of the cooling medium. It consists of a highly heat conductive layer (1, 7, 11, 19 27 27C) with extensions (5A, 5B, 8A, 8B, 8A1, 8B1) having louver-like structures with fins (6, 9) for virtually boundary-layer free efficient heat transfer with a single layer (1, 11, 27), or with nested multiple layers (7, 19). It can be incorporated into the structure of a new component, or it can be attached to an existing component by heat conductive adhesive bonding (4).

REFERENCES:
patent: 3187812 (1965-06-01), Staver
patent: 3212569 (1965-10-01), McAdam
patent: 3213324 (1965-10-01), McAdam
patent: 3480837 (1969-11-01), Feldmann
patent: 4588028 (1986-05-01), Marshall et al.
patent: 5229914 (1993-07-01), Bailey

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