Heat dissipative integrated circuit chip package

Details Heat dissipative integrated circuit chip package Heat dissipative integrated circuit chip package

1984-11-29

1986-09-16

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 612386, H02B 100

Patent

active

046126015

ABSTRACT:
An integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a plurality of heat radiation plates, a heat radiation cover, a heat sink rigidly mounted on the heat radiation cover and a plurality of terminals. The plurality of integrated circuit chips are each provided with a plurality of flexible beam leads on a body thereof and electrically and mechanically connected with the substrate via the beam lead. The heat radiation plates are each composed of a good thermal conductor and rigidly joined with the integrated circuit chips and a one-to-one correspondence by a first adhesive material. A radiation cover is also composed of a good thermo conductor and covers the chip mounting surface of the substrate and is held in contact with the heat radiation plates through a second adhesive material. The plurality of terminals are attached on a chip non-mounting surface of the substrate for input and output of signals to and from the chips and for supplying a voltage from the power source to the chips.

REFERENCES:
patent: 3765970 (1973-10-01), Athanas
patent: 4322778 (1982-03-01), Barbour
patent: 4330812 (1982-05-01), Token
patent: 4338621 (1982-07-01), Braun
patent: 4396936 (1983-08-01), McIver
patent: 4442450 (1984-04-01), Lipschutz
patent: 4498122 (1985-02-01), Rainal
"High Performance . . . Module", IBM Tech. Discl. Bull., vol. 20, No. 4, Sep. 1977, p. 1438, Doo.

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