Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-07-02
2001-09-11
Feild, Lynn D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C165S104330, C174S015200
Reexamination Certificate
active
06288896
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to a heat dissipation apparatus for portable electronic devices, and more specifically, to a heat dissipation apparatus using heat pipes for a laptop computer.
Increasingly complex integrated circuits for use with computers, and more specifically, with laptop or portable computers, have resulted in numerous known advantages. However, these advantages are not without their corresponding drawbacks, namely, the generation of more heat than computers using less complex integrated circuits. Cooling of heat-producing components within a laptop computer can be critical to avoid excessive amounts of heat buildup which can adversely affect the performance of a microprocessor chip and other electronic components. Several systems are available to attempt to cool the electronic components of a portable computer.
For example, an electric fan placed near heat-generating components can blow hot air away from such components. However there are some drawbacks to using the electric fan. First, the necessity for moving parts in these electric fans makes them susceptible to breakage. Second, the electric fans generate a significant amount of noise. Third, the use of electric fans in portable battery-powered computers, where maximum battery life is desirable, is a drawback since providing power to the electric fan reduces the battery life of the computer. Fourth, the relatively large size of a typical electric fan requires a large amount of space inside the portable computer, where space is at a premium. Fifth, circulation of air into the electric fan also pulls in dust and debris. For at least the foregoing reasons, it would be desirable to provide sufficient heat dissipation away from heat-generating electronic components without the need to use an electric fan.
Another heat dissipation device involves the use of a heat sink. Essentially, the heat sink is placed in thermal communication with the processor or other heat-generating components to transfer heat away from such components into the heat sink. The transferred heat is then dissipated through the surface area of the heat sink, thereby reducing the amount of heat buildup in the electronic components. However, there are some drawbacks to using only heat sinks, especially in portable computers that implement processors which generate a significant amount of heat. First, if a significant amount of heat is generated, then a larger-sized heat sink is necessary to adequately dissipate the amount of heat. Second, larger-sized heat sinks tend to weigh more and take up more space.
A third and relatively new method of dissipating heat from a processor involves the use of a heat pipe. Heat pipes operate by placing an evaporation portion of the heat pipe in thermal communication with a heat-generating electronic component. The second end or condensation portion of the heat pipe is positioned away from the heat-generating component. The heat pipe typically contains a fluid that flows along a wick attached to the inner surface of the pipe. Heat from a heat-generating electronic component vaporizes the fluid which creates a pressure differential between the end of the heat pipe thermally coupled to the heat source and the remote end of the heat pipe. The pressure differential pumps the fluid through the wick from the condensation portion to the evaporation portion. The vaporized fluid is then pumped from the evaporation portion to the condensation portion of the heat pipe. Heat pipes have the potential of rapidly transferring heat away from a microprocessor chip or other heat-generating component. Hence, the use of heat pipes will be desirable in situations when the use of an electric fan or a large heat sink are undesirable.
It is desirable to integrate the use of heat pipes in portable computers in a manner which can be easily manufactured and yet provide reliable and sturdy support for the heat pipe to avoid crimping or other damage thereto. It is further desirable to transfer the heat from the heat-generating components to a large, remote heat sink where the heat will not damage electronic components.
SUMMARY OF THE INVENTION
The present invention provides exemplary heat dissipation systems, and portable electronic devices using such systems, to efficiently dissipate heat from heat-generating electronic components. More specifically, the present invention involves heat dissipation systems which include heat pipes to transfer heat from a processor or other electronic components, through a specialized joint and into the lid assembly of the portable computer. The present invention further provides sufficient electromagnetic interference (EMI) shielding of the processor in order to mitigate against the likelihood of transmitting EMI throughout the computer by way of the heat pipe.
The present invention provides a heat dissipation system for use in a hinged computing device which includes a thermally conductive joint or coupling element. The joint has first and second receptacles or bores which are generally parallel to and adjacent one another. The heat dissipation system includes first and second heat pipes, each having first and second ends. The first end of the first heat pipe is at least partially disposed within the first receptacle and the second end is adapted to be thermally coupled to a heat source within the hinged computing device, such as a processor, a micro processor module, or the like. It will be appreciated by those skilled in the art, that the heat source can be a wide range of heat-generating electronic components within the scope of the present invention. The first end of the second heat pipe is at least partially disposed within the second receptacle and the second end is adapted to be thermally coupled to a heat sink portion of the hinged computing device. In this manner, the thermally conductive joint permits the transfer of heat from the first heat pipe to the second heat pipe. The second heat pipe, in turn, transfers heat to the heat sink portion of the hinged computing device.
Preferably, the thermally conductive joint includes copper. However, other thermally conductive materials, including other metals, may be used within the scope of the present invention. The joint preferably comprises first and second portions connected to one another. The first portion includes the first receptacle and the second portion includes the second receptacle. In this manner, the joint can be manufactured in two pieces and later assembled along with the heat pipes as part of a heat dissipation system. Alternatively, the joint comprises either a single piece, or more than two pieces operably connected together.
In one aspect, the first heat pipe has first and second portions. The first portion is generally round and at least partially disposed within the first receptacle, and the second portion is generally flat. In this manner, the generally round portion can be readily rotated within the first receptacle and the generally flat portion can be positioned within the tight confines of a portable laptop computer to be thermally coupled to the heat source. Similarly, the second heat pipe preferably includes a first portion that is generally round and at least partially disposed within the second receptacle, and a second portion that is generally flat.
In another aspect, the heat dissipation system further includes a heat spreader that is operably attached to the first heat pipe and is adapted to be thermally coupled to, and at least partially enclose the heat source. In one aspect, the heat spreader further includes at least one thermally conductive pad adapted to be thermally coupled to the heat source. In this manner, the thermally conductive pad may be in contact with a heat source to assist the transfer of heat from the heat source to the first heat pipe. In one particular aspect, the heat spreader includes an EMI shield. In this manner, the heat spreader helps reduce the likelihood that the first heat pipe will transfer EMI throughout the laptop computer.
In still another aspect of the
Acer Incorporated
Feild Lynn D.
Towsend and Townsend and Crew LLP
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