Heat dissipation structure of a print circuit board

Details Heat dissipation structure of a print circuit board Heat dissipation structure of a print circuit board

2009-02-20

2011-10-18

Nasri, Javaid (Department: 2839)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08039752

ABSTRACT:
A heat dissipating structure of a print circuit board to improve heat-dissipation efficiency for mounted electronic components while retaining required soldering strength is disclosed.The heat dissipation structure of a print circuit board comprising a stack of multiple layers including a mounting surface layer on which electronic components including heat generating components are soldered. On both sides of the print circuit board, inner vias bore surface layers but inner layers are not bored. Core vias bore the inner layers in the print circuit board but the surface layers are not bored. The inner vias and the core vias are positioned at the predetermined distance over the layer surface. Heat from heat generating components is conducted through the inner vias on surface layers and the core vias inside the circuit board to the outside, high efficiency of the heat-dissipation is achieved.

REFERENCES:
patent: 6188308 (2001-02-01), Kojima et al.
patent: 6438821 (2002-08-01), Kojima et al.
patent: 2001-168476 (2001-06-01), None
patent: 2005-158914 (2005-06-01), None

Affiliated with

Also associated with

Rating

Heat dissipation structure of a print circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation structure of a print circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation structure of a print circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4281001