Heat dissipation structure for interface card

Details Heat dissipation structure for interface card Heat dissipation structure for interface card

2008-05-13

2008-05-13

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C165S080200, C165S080300, C165S185000

Reexamination Certificate

active

11307543

ABSTRACT:
A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

REFERENCES:
patent: 6025992 (2000-02-01), Dodge et al.
patent: 6091145 (2000-07-01), Clayton
patent: 6410857 (2002-06-01), Gonya
patent: 6449159 (2002-09-01), Haba
patent: 6583986 (2003-06-01), Storti et al.
patent: 6765793 (2004-07-01), Kehret et al.
patent: 7023701 (2006-04-01), Stocken et al.
patent: 2003/0076657 (2003-04-01), Summers et al.

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