Heat dissipation structure for electronic devices

Details Heat dissipation structure for electronic devices Heat dissipation structure for electronic devices

2007-06-25

2009-06-30

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C361S714000, C174S016100, C174S016300, C165S080300, C165S104330

Reexamination Certificate

active

07554805

ABSTRACT:
The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

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