Heat dissipation structure for communication chassis

Details Heat dissipation structure for communication chassis Heat dissipation structure for communication chassis

2011-04-12

2011-04-12

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S679520, C361S679540, C361S703000, C361S704000, C361S719000, C361S720000, C361S721000, C165S185000, C174S015200, C174S547000, C174S548000

Reexamination Certificate

active

07924565

ABSTRACT:
A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.

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