Heat dissipation structure

Details Heat dissipation structure Heat dissipation structure

2006-06-06

2006-06-06

Duong, Hung Van (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C428S458000, C174S255000

Reexamination Certificate

active

07057891

ABSTRACT:
A heat dissipation structure includes a heat-producing electronic component on a substrate, a thermally conductive case, and grease. The electronic component and the substrate are housed in the case. The grease is provided between the case and the electronic component or the substrate for transmitting heat produced by the electronic component to the case. The case has contact surfaces that contact with the grease. The contact surfaces have free energy equal to or higher than 20 mN/m and roughness equal to or larger than 1.0 μm.

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