Heat dissipation structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S700000, C361S704000, C361S710000, C165S080300, C165S104330, C257S719000, C257S722000

Reexamination Certificate

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07149083

ABSTRACT:
A heat dissipation structure installed on a computer central processing unit or a heat generating device, has a thermal conductive base, at least one heat pipe and a heat sink. The thermal conductive base has a supporting part and a first interlocking part. The supporting part allows the heat pipe mounted thereon. The heat sink has a plurality of fins configured with a receiving slot and a second interlocking part. The second interlocking part is engaged with the first interlocking part, while the receiving slot and the supporting part of the thermal conductive base enclose the heat pipe therein to form the heat dissipation structure. By the connection between the thermal conductive pipe and the heat sink, the contact intensity between various devices is increased, such that the heat conduction performance is improved.

REFERENCES:
patent: 6382306 (2002-05-01), Hsu
patent: 6816373 (2004-11-01), Lee et al.
patent: 6851467 (2005-02-01), Bamford et al.
patent: 6860321 (2005-03-01), Ji-Hai et al.
patent: 2005/0073811 (2005-04-01), Wang et al.

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