Heat dissipation package for integrated circuits

Details Heat dissipation package for integrated circuits Heat dissipation package for integrated circuits

1987-06-15

1989-10-31

Hille, Rolf

357 72, H01L 2302

Patent

active

048781088

ABSTRACT:
A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An external heat sink is mounted onto the plastic body. A clip or through bolt establishes thermal contact between the external heat sink and the internal thermally conductive strip.

REFERENCES:
patent: 3670215 (1972-06-01), Wilkens
patent: 3780795 (1973-12-01), Arnold
patent: 3836825 (1974-09-01), Hall et al.
patent: 3911327 (1975-10-01), Murari et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4259685 (1981-03-01), Romano
patent: 4342068 (1982-07-01), Kling
patent: 4460917 (1984-07-01), Rogers
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4648008 (1987-03-01), Neyroud et al.
patent: 4688077 (1987-08-01), Wakabayashi et al.
patent: 4712159 (1987-12-01), Clemens
Grabbe et al., Automated Packaging of a Premolded Chip Carrier, 1979, pp. 1-7.
2280/2286 Series Heat Sinks for Leadless Chip Carriers and Flat Paks.
2244 Research Disclosure (1986) May, No. 265, New York, U.S.A.

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