Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-07
2007-08-07
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S695000, C165S121000, C165S104330, C174S015200
Reexamination Certificate
active
11283285
ABSTRACT:
A heat dissipation module for a mobile computer, the mobile computer having a base (10) and a display unit (20) pivotally coupled to the base, the base having a number of through holes (13) defined on a shell (18) thereof, the heat dissipation module including: a cooling fan (14) disposed near the through holes of the shell; and a heat pipe (15) having a evaporating section (52), a condensing section (56), and an intermediate section (54) connecting the evaporating section and the condensing section; wherein the evaporating section of the heat pipe is disposed between the shell and the cooling fan, and the condensing section of the heat pipe is disposed on the display unit of the mobile computer.
REFERENCES:
patent: 5847925 (1998-12-01), Progl et al.
patent: 6031716 (2000-02-01), Cipolla et al.
patent: 6175493 (2001-01-01), Gold
patent: 6250378 (2001-06-01), Kobayashi
patent: 6253836 (2001-07-01), Mitchell
patent: 6288896 (2001-09-01), Hsu
patent: 6341062 (2002-01-01), Patel
patent: 6459576 (2002-10-01), Bhatia et al.
patent: 6507490 (2003-01-01), Sasaki et al.
patent: 6751095 (2004-06-01), Ishikawa et al.
patent: 6816371 (2004-11-01), Agata et al.
patent: 11330757 (1999-11-01), None
patent: 02000277963 (2000-10-01), None
patent: 02001068883 (2001-03-01), None
patent: 425501 (2001-03-01), None
Chen Ga-Lane
Leu Charles
Lin Jhy-Chain
Yu Tai-Cherng
Datskovskiy Michael
Hon Hai Precision Industry Co. Ltd.
Morris Manning & Martin LLP
Tingkang Xia, Esq. Tim
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