Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-01
2008-08-19
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S700000, C361S704000, C165S080300, C165S185000, C174S015200
Reexamination Certificate
active
07414850
ABSTRACT:
A heat dissipation module for removing heat from a heat-generating electronic component includes a base (106) and a clip (40, 40a). The clip includes a connecting arm (42, 42a) and a securing arm (44, 44a) for locking the base to the heat-generating electronic component. The connecting arm engages with the base. The securing arm extends from the contacting arm and is curve-shaped with a free end thereof being for being depressed whereby the securing arm exerts a downward force on the base so that the base and the electronic component can have an intimate contact with each other.
REFERENCES:
patent: 6301107 (2001-10-01), Lev et al.
patent: 6400565 (2002-06-01), Shabbir et al.
patent: 6567269 (2003-05-01), Homer et al.
patent: 6754077 (2004-06-01), Lo et al.
patent: 6883594 (2005-04-01), Sarraf et al.
patent: 7283364 (2007-10-01), Refai-Ahmed et al.
patent: 7310227 (2007-12-01), Kusamoto et al.
patent: 7312997 (2007-12-01), Huang et al.
patent: 2004/0188079 (2004-09-01), Chiou et al.
Chervinsky Boris
Foxconn Technology Co., Ltd.
Knapp Jeffrey T.
Smith Courtney L
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