Heat dissipation module and flow direction controlling...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S694000, C415S211200, C454S347000

Reexamination Certificate

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07417856

ABSTRACT:
A heat dissipation module is disclosed. A first heat dissipation apparatus and a second heat dissipation apparatus are symmetrically disposed. A flow direction controlling structure has a rotatable element disposed between the first and second heat dissipation apparatuses and formed an isolation wall thereof, so that the first and second heat dissipation apparatuses respectively have a tunnel. Each of the rotatable elements has a fixed end and a correspondingly movable end for guiding air flow. When outlet pressures of the first and second heat dissipation apparatuses are different, the movable end deflects to the first heat dissipation apparatus or the second heat dissipation apparatus to change outlet areas thereof. The heat dissipation module and the flow direction controlling structure control air flow and prevent backflow, so as to maintain overall outlet area and improve heat dissipation effect of the module.

REFERENCES:
patent: 4648007 (1987-03-01), Garner
patent: 6108203 (2000-08-01), Dittus et al.
patent: 6936767 (2005-08-01), Kleinecke et al.
patent: 7018169 (2006-03-01), Phillip et al.
patent: 7128526 (2006-10-01), Paulsen
patent: 2004112899 (2004-04-01), None
patent: 802628 (1981-02-01), None
Wenzel, Dual FAn N+1 Enclosure, Feb. 1993, IBM TechnicalDisclosure Bulletin, vol. 36, No. 02, pp. 315-316.

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