Heat dissipation module and detachable expansion card using...

Details Heat dissipation module and detachable expansion card using... Heat dissipation module and detachable expansion card using...

2008-08-07

2010-12-14

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C361S700000, C361S719000, C165S104330, C257SE23099

Reexamination Certificate

active

07852632

ABSTRACT:
A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

REFERENCES:
patent: 5718282 (1998-02-01), Bhatia et al.
patent: 5854738 (1998-12-01), Bowler
patent: 6226178 (2001-05-01), Broder et al.
patent: 6667882 (2003-12-01), Pauser
patent: 7100681 (2006-09-01), Wu et al.
patent: 7382616 (2008-06-01), Stefanoski
patent: 2007/0097644 (2007-05-01), Lu et al.
patent: 2007/0268670 (2007-11-01), Chu et al.
patent: 2009/0059538 (2009-03-01), Peng et al.

Affiliated with

Also associated with

Rating

Heat dissipation module and detachable expansion card using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation module and detachable expansion card using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation module and detachable expansion card using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4203711