Heat dissipation module and computer having same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S695000, C361S689000, C361S689000, C415S203000, C415S206000, C165S080200, C417S423700

Reexamination Certificate

active

07492587

ABSTRACT:
A heat dissipation module and an electronic device assembly having the heat dissipation module are provided. The electronic device includes an enclosure, a plurality of heat generating components received in the enclosure, an electronic device received in the enclosure, and a heat dissipation module received in the enclosure. The electronic device has a motor. The heat dissipation module includes a casing defining an airflow passage therethrough, and a rotation member being disposed at the airflow passage and having a plurality of blades. The airflow passage communicates with outside of the enclosure. The motor is capable of driving the rotation member to rotate to thereby expel heat inside of the enclosure to outside of the enclosure via airflow generated by the blades.

REFERENCES:
patent: 5879141 (1999-03-01), Yokozawa et al.
patent: 6164690 (2000-12-01), Vian
patent: 6552993 (2003-04-01), Huang
patent: 6606254 (2003-08-01), Yoneda
patent: 6726455 (2004-04-01), Horng et al.
patent: 6972950 (2005-12-01), Wyatt et al.
patent: 7029247 (2006-04-01), Huang
patent: 7154750 (2006-12-01), Li et al.
patent: 7317614 (2008-01-01), Ruch et al.
patent: 2003/0223864 (2003-12-01), Horng et al.
patent: 2006/0078428 (2006-04-01), Zheng

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipation module and computer having same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation module and computer having same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation module and computer having same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4065063

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.