Heat dissipation module

Details Heat dissipation module Heat dissipation module

2008-08-29

2010-06-08

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S790000, C165S104260, C165S272000, C165S180000, C257S712000, C062S260000

Reexamination Certificate

active

07733654

ABSTRACT:
A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has a heat insulated pipe-wall which partitions the diversion pipeline into an inside and an outside portions and reduces the heat conduction in the diversion direction of the diversion pipeline. The heat conductive pieces are fixed on the diversion pipeline, and have a heat dissipation direction from the inside portion to the outside portion of the diversion pipeline which crosses the diversion direction. Each two neighboring heat conductive pieces are separated with the heat insulated pipe-wall. The fan is assembled on the outside of the diversion pipeline and provides a cool air for the heat conductive pieces.

REFERENCES:
patent: 2003/0056943 (2003-03-01), Dessiatoun et al.

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