Heat dissipation module

Details Heat dissipation module Heat dissipation module

2006-06-30

2009-11-17

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C165S080300, C165S104330, C165S185000, C257S718000

Reexamination Certificate

active

07619890

ABSTRACT:
A heat dissipation module includes a heat dissipation device, a resilient bracket and a cylindrically shaped nut. The heat dissipation device is attached to a heat generating component. The cylindrically shaped nut has an arc surface and two circular surfaces. A screw hole is formed on one of the two circular surfaces and an engraved slot is formed on the arc surface. The resilient bracket is secured to the heat dissipation device at an end and has a U-shaped cutout at an opposite end, wherein the U-shaped cutout has a constricted opening for receiving the cylindrically shaped nut. The U-shaped cutout engages with the engraved slot.

REFERENCES:
patent: 3369215 (1968-02-01), Haegert
patent: 3407382 (1968-10-01), Haegert
patent: 4802532 (1989-02-01), Dawes et al.
patent: 5301907 (1994-04-01), Julian
patent: 5346782 (1994-09-01), Julian
patent: 5620338 (1997-04-01), Stephens et al.
patent: 5646826 (1997-07-01), Katchmar
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 5982622 (1999-11-01), Chiou
patent: 6097601 (2000-08-01), Lee
patent: 6141220 (2000-10-01), Lin
patent: 6307747 (2001-10-01), Farnsworth et al.
patent: 6356445 (2002-03-01), Mochzuki et al.
patent: 6367840 (2002-04-01), Duval et al.
patent: 6480387 (2002-11-01), Lee et al.
patent: 6557675 (2003-05-01), Iannuzzelli
patent: 6639800 (2003-10-01), Eyman et al.
patent: 6865082 (2005-03-01), Huang et al.
patent: 6929484 (2005-08-01), Weiss et al.
patent: 7019979 (2006-03-01), Wang et al.
patent: 7277293 (2007-10-01), Yang et al.
patent: 7283368 (2007-10-01), Wung et al.
patent: 7292447 (2007-11-01), Xia et al.
patent: 7342796 (2008-03-01), Aukzemas
patent: 7375963 (2008-05-01), Eckberg et al.
patent: 2007/0025086 (2007-02-01), Huang et al.
patent: 2007/0097649 (2007-05-01), Yang et al.
patent: 2007/0217159 (2007-09-01), Long et al.

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