Heat dissipation module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Reexamination Certificate

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11097323

ABSTRACT:
The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

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patent: 2006/0090882 (2006-05-01), Sauciuc
patent: 2006/0196640 (2006-09-01), Siu
patent: 2007/0068654 (2007-03-01), Chang

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